DDR Interface Designer Settings
The following tables describe the settings for the DDR block in the Interface Designer.
| Parameter | Choices | Notes |
|---|---|---|
| DDR Resource | None, DDR_0 | Only one resource available. |
| Instance Name | User defined | Indicate the DDR instance name. This name is the prefix for all DDR signals. |
| Memory Type | DDR3, LPDDR2, LPDDR3 | Choose the memory type you want to use. |
| Parameter | Choices | Notes |
|---|---|---|
| Select Preset | The Select Preset button opens a list of
popular DDR memory configurations. Choose a preset to populate the
configuration choices. If you do not want to use a preset, you can
specify the memory configuration manually. |
|
| DQ Width |
x8, x16, x32
|
DQ bus width. The width choices vary depending
on the FPGA and package. |
| Type | DDR3, LPDDR2, LPDDR3 | Memory type. |
| Enable Advanced Density Setting | On, Off | If you do not want to use the available density from the Density parameter, you can set the memory row and column width. |
| Row Width | 0 - 99 | Specify the memory row width. |
| Column Width | 0 - 99 | Specify the memory column width. |
| DDR3 | ||
| Speed Grade | 1066E, 1066F, 1066G, 800D, 800E | Memory speed. |
| Width | x8, x16 | Memory width. |
| Density | 1G, 2G, 4G, 8G | Memory density in bits. |
| LPDDR2 | ||
| Speed Grade | 400, 533, 667, 800, 1066 | Memory speed. |
| Width |
x16, x32
|
Memory width. The width choices vary depending
on the FPGA and package. |
| Density | 256M, 512M, 1G, 2G, 4G | Memory density in bits. |
| LPDDR3 | ||
| Speed Grade | 800, 1066 | Memory speed. |
| Width |
x16, x32
|
Memory width. The width choices vary depending
on the FPGA and package. |
| Density | 4G, 8G | Memory density in bits. |
| Parameter | Choices | Notes |
|---|---|---|
| FPGA Input Termination | Varies depending on the memory type | Specify the termination value for the FPGA input/output pins. |
| FPGA Output Termination |
| Parameter | Choices | Notes |
|---|---|---|
| DDR3 | ||
| Burst Length | 8 | Specify the burst length (only 8 is supported). |
| DLL Precharge Power Down | On, Off | Specify whether the DLL in the memory device is off or on during precharge power-down. |
| Memory Auto Self-Refresh | Auto, Manual | Turn on or off auto-self refresh feature in memory device. |
| Memory CAS Latency (CL) | 5 - 14 | Specify the number of clock cycle between read command and the availability of output data at the memory device. |
| Memory Write CAS Latency (CWL) | 5 - 12 | Specify the number of clock cycle from the releasing of the internal write to the latching of the first data in at the memory device. |
| Memory Dynamic ODT (Rtt_WR) | Off, RZQ/2, RZQ/4 | Specify the mode of dynamic ODT feature of memory device. |
| Memory Input Termination (Rtt_nom) | Off, RZQ/2, RZQ/4, RZQ/6, RZQ/8, RZQ/12 | Specify the input termination value of the memory device. |
| Memory Output Termination | RZQ/6, RZQ/7 | Specify the output termination value of the memory device. |
| Read Burst Type | Interleaved, Sequential | Specify whether accesses within a give burst are in sequential or interleaved order. |
| Sef-Refresh Temperature | Extended, Normal | Specify whether the self refresh temperature is normal or extended mode. |
| LPDDR2 | ||
| FPGA Input Termination (Ω) | 120, Off | Specify the input termination of the FPGA device. Used in non-JEDEC
standard only. Note: Enabling this option leads to
higher power consumption. |
| Burst Length | 8 | Specify the burst length (only 8 is supported). |
| Output Drive Strength | 34.3, 40, 48, 60, 80, 120 | Specify the output termination value of memory device. |
| Read Burst Type | Interleaved, Sequential | Specify whether accesses within a given burst are in sequential or interleaved order. |
| Read/Write Latency | RL=3/WL=1, RL=4/WL=2 RL=5/WL=2, RL=6/WL=3 RL=7/WL=4,
RL=8/WL=4 |
Specify the read/write latency of the memory device. |
| LPDDR3 | ||
| DQ ODT | Disable, RZQ1, RZQ2, RZQ4 | Specify the input termination value of memory device. |
| Output Drive Strength | 34.3 34.3 pull-down/40 pull up 34.3 pull-down/48 pull
up 40 40 pull down/48 pull
up 48 |
Specify the output termination value of memory device. |
| Read/Write Latency | RL=3/WL=1, RL=6/WL=3 RL=8/WL=4, RL=9/WL=5 |
Specify the read/write latency of the memory device. |
| Parameter | Choices | Notes |
|---|---|---|
| tFAW, Four Bank Active Window (ns) | User defined | Enter the timing parameters from the memory device's data sheet. |
| tRAS, Active to Precharge Command Period (ns) | ||
| tRC, Active to Actrive or REF Command Period (ns) | ||
| tRCD, Active to Read or Write Delay (ns) | ||
| tREFI, Average Periodic Refresh Interval (ns) | ||
| tRFC, Refresh to Active or Refresh to Refresh Delay (ns) | ||
| tRP, Precharge Command Period (ns) | ||
| tRRD, Active to Active Command Period (ns) | ||
| tRTP, Internal Read to Precharge Delay (ns) | ||
| tWTR, Internal Write to Read Command Delay (ns) |
| Parameter | Choices | Notes |
|---|---|---|
| Controller to Memory Address Mapping | BANK-ROW-COL ROW-BANK-COL ROW-COL_HIGH-BANK-COL_LOW |
Specify the mapping between the address of AXI interface and column, row, and bank address of memory device. |
| Enable Auto Power Down | Active, Off, Pre-Charge | Specify whether to allow automatic entry into power-down mode (pre-charge or active) after a specific amount of idle time. |
| Enable Self Refresh Controls | No, Yes | Specify whether to enable automatic entry into self-refresh mode after specific amount of idle period. |
| Parameter | Choices | Notes |
|---|---|---|
| Enable Gate Delay Override | On or off | Turning this option on allows you to fine-tine the gate-delay values. This is an expert only setting. |
| Gate Coarse Delay Tuning | 0 - 5 | |
| Gate Fine Delay Tuning | 0 - 255 |
| Option | Notes |
|---|---|
| Disable Control | When selected, this option disables calibration and user reset. |
| Enable Calibration | Turn on to enable optional PHY calibration pins (master reset, SCL, and SDA pins). Efinix recommends that you use the default pin names. The names are prefixed with the instance name you specified in the Base tab. These pins connect to the DDR Hard Memory Controller - Calibration and Reset IP core. |
| Enable User Reset | Turn on to enable optional reset pins (master reset and sequencer start/reset). Efinix recommends that you use the default pin names. The names are prefixed with the instance name you specified in the Base tab. These pins connect to the DDR Hard Memnory Controller - Reset IP core. |
| Enable Reset and Calibration | Turn on to enable the pins for calibration and user reset. These pins connect to the DDR Hard Memory Controller - Calibration and Reset IP core. |
| Parameter | Choices | Notes |
|---|---|---|
| Enable Target 0 Enable Target 1 |
On or off | Turn on to enable the AXI 0 interface. Turn on to enable the AXI
1 interface. |
| AXI Clock Input Pin name | User defined | Specify the name of the AXI input clock pin. |
| Invert AXI Clock Input | On or off | Turn on to invert the AXI clock. |
| Shared Read/Write Address Channel tab Write Response Channel
tab Read Data Channel tab Write Data Channel
tab |
User defined | This tab defines the AXI signal names. Efinix recommends that you use the default names. The signals are prefixed with the instance name you specified in the Base tab. |