DDR Interface Designer Settings

The following tables describe the settings for the DDR block in the Interface Designer.

Table 1. Base Tab
Parameter Choices Notes
DDR Resource None, DDR_0 Only one resource available.
Instance Name User defined Indicate the DDR instance name. This name is the prefix for all DDR signals.
Memory Type DDR3, LPDDR2, LPDDR3 Choose the memory type you want to use.
Table 2. Configuration Tab
Parameter Choices Notes
Select Preset The Select Preset button opens a list of popular DDR memory configurations. Choose a preset to populate the configuration choices.
If you do not want to use a preset, you can specify the memory configuration manually.
DQ Width
x8, x16, x32
DQ bus width.
The width choices vary depending on the FPGA and package.
Type DDR3, LPDDR2, LPDDR3 Memory type.
Enable Advanced Density Setting On, Off If you do not want to use the available density from the Density parameter, you can set the memory row and column width.
Row Width 0 - 99 Specify the memory row width.
Column Width 0 - 99 Specify the memory column width.
DDR3
Speed Grade 1066E, 1066F, 1066G, 800D, 800E Memory speed.
Width x8, x16 Memory width.
Density 1G, 2G, 4G, 8G Memory density in bits.
LPDDR2
Speed Grade 400, 533, 667, 800, 1066 Memory speed.
Width
x16, x32
Memory width.
The width choices vary depending on the FPGA and package.
Density 256M, 512M, 1G, 2G, 4G Memory density in bits.
LPDDR3
Speed Grade 800, 1066 Memory speed.
Width
x16, x32
Memory width.
The width choices vary depending on the FPGA and package.
Density 4G, 8G Memory density in bits.
Table 3. Advanced Options Tab - FPGA Setting Subtab
Parameter Choices Notes
FPGA Input Termination Varies depending on the memory type Specify the termination value for the FPGA input/output pins.
FPGA Output Termination
Table 4. Advanced Options Tab - Memory Mode Register Settings Subtab
Parameter Choices Notes
DDR3
Burst Length 8 Specify the burst length (only 8 is supported).
DLL Precharge Power Down On, Off Specify whether the DLL in the memory device is off or on during precharge power-down.
Memory Auto Self-Refresh Auto, Manual Turn on or off auto-self refresh feature in memory device.
Memory CAS Latency (CL) 5 - 14 Specify the number of clock cycle between read command and the availability of output data at the memory device.
Memory Write CAS Latency (CWL) 5 - 12 Specify the number of clock cycle from the releasing of the internal write to the latching of the first data in at the memory device.
Memory Dynamic ODT (Rtt_WR) Off, RZQ/2, RZQ/4 Specify the mode of dynamic ODT feature of memory device.
Memory Input Termination (Rtt_nom) Off, RZQ/2, RZQ/4, RZQ/6, RZQ/8, RZQ/12 Specify the input termination value of the memory device.
Memory Output Termination RZQ/6, RZQ/7 Specify the output termination value of the memory device.
Read Burst Type Interleaved, Sequential Specify whether accesses within a give burst are in sequential or interleaved order.
Sef-Refresh Temperature Extended, Normal Specify whether the self refresh temperature is normal or extended mode.
LPDDR2
FPGA Input Termination (Ω) 120, Off Specify the input termination of the FPGA device. Used in non-JEDEC standard only.
Note: Enabling this option leads to higher power consumption.
Burst Length 8 Specify the burst length (only 8 is supported).
Output Drive Strength 34.3, 40, 48, 60, 80, 120 Specify the output termination value of memory device.
Read Burst Type Interleaved, Sequential Specify whether accesses within a given burst are in sequential or interleaved order.
Read/Write Latency RL=3/WL=1, RL=4/WL=2
RL=5/WL=2, RL=6/WL=3
RL=7/WL=4, RL=8/WL=4
Specify the read/write latency of the memory device.
LPDDR3
DQ ODT Disable, RZQ1, RZQ2, RZQ4 Specify the input termination value of memory device.
Output Drive Strength 34.3
34.3 pull-down/40 pull up
34.3 pull-down/48 pull up
40
40 pull down/48 pull up
48
Specify the output termination value of memory device.
Read/Write Latency RL=3/WL=1, RL=6/WL=3
RL=8/WL=4, RL=9/WL=5
Specify the read/write latency of the memory device.
Table 5. Advanced Options Tab - Memory Timing Settings Subtab
Parameter Choices Notes
tFAW, Four Bank Active Window (ns) User defined Enter the timing parameters from the memory device's data sheet.
tRAS, Active to Precharge Command Period (ns)
tRC, Active to Actrive or REF Command Period (ns)
tRCD, Active to Read or Write Delay (ns)
tREFI, Average Periodic Refresh Interval (ns)
tRFC, Refresh to Active or Refresh to Refresh Delay (ns)
tRP, Precharge Command Period (ns)
tRRD, Active to Active Command Period (ns)
tRTP, Internal Read to Precharge Delay (ns)
tWTR, Internal Write to Read Command Delay (ns)
Table 6. Advanced Options Tab - Controller Settings Subtab
Parameter Choices Notes
Controller to Memory Address Mapping BANK-ROW-COL
ROW-BANK-COL
ROW-COL_HIGH-BANK-COL_LOW
Specify the mapping between the address of AXI interface and column, row, and bank address of memory device.
Enable Auto Power Down Active, Off, Pre-Charge Specify whether to allow automatic entry into power-down mode (pre-charge or active) after a specific amount of idle time.
Enable Self Refresh Controls No, Yes Specify whether to enable automatic entry into self-refresh mode after specific amount of idle period.
Table 7. Advanced Options Tab - Gate Delay Tuning Settings Subtab
Parameter Choices Notes
Enable Gate Delay Override On or off Turning this option on allows you to fine-tine the gate-delay values. This is an expert only setting.
Gate Coarse Delay Tuning 0 - 5
Gate Fine Delay Tuning 0 - 255
Table 8. Control Tab
Option Notes
Disable Control When selected, this option disables calibration and user reset.
Enable Calibration Turn on to enable optional PHY calibration pins (master reset, SCL, and SDA pins). Efinix recommends that you use the default pin names. The names are prefixed with the instance name you specified in the Base tab. These pins connect to the DDR Hard Memory Controller - Calibration and Reset IP core.
Enable User Reset Turn on to enable optional reset pins (master reset and sequencer start/reset). Efinix recommends that you use the default pin names. The names are prefixed with the instance name you specified in the Base tab. These pins connect to the DDR Hard Memnory Controller - Reset IP core.
Enable Reset and Calibration Turn on to enable the pins for calibration and user reset. These pins connect to the DDR Hard Memory Controller - Calibration and Reset IP core.
Table 9. AXI 0 and AXI 1 Tabs
Parameter Choices Notes
Enable Target 0
Enable Target 1
On or off Turn on to enable the AXI 0 interface.
Turn on to enable the AXI 1 interface.
AXI Clock Input Pin name User defined Specify the name of the AXI input clock pin.
Invert AXI Clock Input On or off Turn on to invert the AXI clock.
Shared Read/Write Address Channel tab
Write Response Channel tab
Read Data Channel tab
Write Data Channel tab
User defined This tab defines the AXI signal names. Efinix recommends that you use the default names. The signals are prefixed with the instance name you specified in the Base tab.