Ti35, Ti60, Ti90, Ti120, and Ti180 shipping now in production volumes. Find a distributor

Titanium™ FPGAs

Enabling the AI-Driven World

   

Energy Efficient, Small Footprint,
Big Compute

You only have a few square millimeters to spare, and you need to pack in as much computing power as you can. Efinix’s Titanium FPGAs are fabricated on a 16 nm process and deliver high performance with efficient power in a compact size. They enable AI acceleration, data analysis, real-time decision making, and other compute-intensive workloads for applications such as machine vision, automotive, hand-held medical devices, and next-generation edge applications.

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Small Packages

With packages down to the tiny WLCSP at just 3.5 mm x 3.4 mm, Titanium FPGAs are designed for highly integrated applications.

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Hardened Controllers

Hardened MIPI D-PHY and LPDDR4/4x DRAM controllers support IoT, thermal cameras, industrial cameras, robotics, and smart devices.

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SEU Detection

Titanium devices can monitor device integrity. You can design your application to recover from random SEU events, ensuring maximum uptime.

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Bitstream Security

Bitstream authentication prevents unwanted tamperting, while bitstream encryption ensures that your design is secure.

Product Longevity

Titanium products are designed into a broad range of applications in many diverse markets. Some of these markets are characterized by long product life cycles and, once in high volume production, are resistant to changes in specifications or components in the bill of materials. At Efinix we get that and are committed to supplying our customers with a stable supply of supported products throughout their product life cycle. We are committed to supporting our Titanium family of FPGAs in customer designs until at least 2045. Contact your local sales representative for more information on product life cycles.

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Industrial

Titanium FPGAs provide sensor fusion, data analysis, and real-time motor control to process the unprecedented quantities of data in today’s industrial applications.

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Edge and Internet of Things

With inherent area efficiency, take Titanium FPGAs to mass production ensuring a seamless transition from prototype to end product and a corresponding reduction in time to market.

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Automotive

Titanium FPGAs are AEC-Q100 certified and ready to handle optical and LiDAR sensors to artificially intelligent data processing to display and motor control.

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Consumer

Titanium FPGAs with a compact architecture deliver low latency, power efficiency, and high performance to support everything from mobile accessories and wearables to AR/VR devices and smart home systems.

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Sensor Aggregation System

Sensor Aggregation System

Cameras and sensors are everywhere, creating large amounts of data. How do you aggregate and process it all?

The Ti90 and larger Titanium FPGAs include hardened 2.5G MIPI interfaces for high-speed links, while the flexible high-speed I/O (HSIO) pins support a wide range of single-ended and differential standards. They function as GPIO, LVDS pairs, or MIPI RX/TX lanes running at speeds up to 1.5 Gbps.

These HSIO pins are fully user configurable, so you can mix and match them to fit your system needs. Use the HSIO pins with the MIPI-CSI-2 protocol to gather data from cameras or sensors and then send it to an application processor. Or, use the DSI protocol to send imaging to a display. The Efinity® software provides D-PHY, CSI-2, and DSI IP to help you create MIPI-based systems more easily.

Ti60 F100: Ready for Vision

 

Titanium FPGA Family

Titanium FPGAs without Transceivers

Feature Ti35 Ti60 Ti80 Ti90 Ti120 Ti125 Ti180
Logic Elements (LEs) 36,176 62,016 78,800 92,534 123,379 122,792 176,256
10K RAM blocks (Mb) 1.53 2.62 3.7 6.88 9.18 5.9 13.11
DSP blocks 93 160 182 336 448 288 640
PLLs 4 4 7 8 8 7 8
High-voltage I/O 34 34 35 80 80 35 80
High-speed I/O 146 146 200 232 232 200 232
MIPI D-PHY, support CSI–2/DSI (Gbps) 1.5 1.5 2.5 1.5 1.5 2.5 1.5
LPDDR4/4x x32 x32 x32
MIPI D-PHY 2.5 Gbps (Hard IP) 4 TX
4 RX
4 TX
4 RX
4 TX
4 RX
Data sheet (PDF)
Product page
Package Pitch (mm) Size (mm) Ti35 Ti60 Ti80 Ti90 Ti120 Ti125 Ti180
64-ball WLCSP 0.4 3.5x3.4
100-ball FBGA (1) 0.5 5.5x5.5
169-ball FBGA (2) 0.5 7x7
225-ball FBGA 0.65 10x10
256-ball FBGA 0.8 13x13
324-ball FBGA 0.8 15x15
361-ball FBGA 0.65 13x13
400-ball FBGA 0.8 16x16
484-ball FBGA (3) 0.65 15x15
484-ball FBGA 0.8 18x18
529-ball FBGA 0.8 19x19
(1) The 100 pin package is available as a regular package as well as a SIP that incorporates SPI flash and HyperRAM in addition to the FPGA.
(2) The 169 pin package is a SIP.
(3) The 484 pin package is a SIP that incorporates LPDDR DRAM in addition to the FPGA.

Titanium FPGA with Transceivers

Feature Ti85 Ti135 Ti140 Ti165 Ti240 Ti260 Ti375 Ti450 Ti660 Ti800 Ti1250 Ti1600 Ti2000
Logic Elements (LEs) 83,232 132,192 142,300 162,800 236,888 264,384 370,137 447,890 656,916 796,262 1,233,020 1,578,000 1,974,067
10K RAM blocks (Mb) 6.18 9.83 10.6 12.1 17.62 19.7 27.53 26.6 38.9 47.2 73.1 93.6 117
DSP blocks 300 480 510 590 860 960 1,344 862 1,260 1,536 2,380 3,050 3,808
PLLs 9 9 12 12 12 12 12 12 12 12 12 12 12
High-voltage I/O 133 133 150 181 181 150 181 180 180 180 180 180 180
High-speed I/O 139 139 160 235 235 160 235 300 300 300 300 300 300
MIPI D-PHY, support CSI–2/DSI (Gbps) 1.5 1.5 2.5 1.5 1.5 2.5 1.5 2.5 2.5 2.5 2.5 2.5 2.5
LPDDR4/4x x32 x32 2 x32 2 x32 2 x32 2 x32 2 x32 3 x32 3 x32 3 x32 4 x32 4 x32 4 x32
MIPI D-PHY 2.5 Gbps (Hard IP) 2 TX
2 RX
2 TX
2 RX
3 TX
3 RX
3 TX
3 RX
3 TX
3 RX
16 Gbps Transceivers x8 x8 x16 x16 x16 x16 x16
25.8 Gbps Transceivers x24 x24 x24 x40 x40 x40
PCIe® Gen4 (16G) 1 x4 1 x4 2 x4 2 x4 2 x4 2 x4 2 x4 2 x8 2 x8 2 x8 3 x8 3 x8 3 x8
Hardened Quad-Core RISC-V Processor RV32 RV32 RV64 RV32 RV32 RV64 RV32 RV64 RV64 RV64 RV64 RV64 RV64
Data sheet (PDF)
Product page
Package Pitch (mm) Size (mm) Ti85 Ti135 Ti140 Ti165 Ti240 Ti260 Ti375 Ti450 Ti660 Ti800 Ti1250 Ti1600 Ti2000
441-ball FBGA 0.5 11x11
484-ball FBGA 0.8 18x18
529-ball FBGA 0.8 19x19
576-ball FBGA (4) 0.65 16x16
676-ball FBGA 0.65 18x18
676-ball FBGA 0.8 22x22
900-ball FBGA 0.8 25x25
1156-ball FBGA 1.0 35x35
1521-ball FBGA 1.0 40x40
(4) The Ti135 576-ball FBGA is offered as a standard FPGA package or as a SiP integrating SPI flash and LPDDR4 DRAM.

Refer to the FPGA data sheet or Titanium Selector Guide for details on which resources (e.g., number of I/O, number of PLLs, MIPI D-PHY, DDR support) are available in each package.

Quantum® Compute Fabric

The innovative Quantum® compute fabric has an enhanced capability for compute functions. The 16 nm process node gives Titanium FPGAs a small footprint with low power consumption, making them ideal for highly integrated applications. With a wide range of logic element (LE) densities from 35K to 1M, and compatibility with the Efinix RISC-V SoCs, they can help you turn a tiny chip into an accelerated embedded compute system.

Why the XLR Cell is a Big Deal White Paper

Learn more about our technology

Titanium FPGA Block Diagram

Resources

Complete Camera System

Video is everywhere, particularly in mobile and mobile-influenced devices like machine vision, drones, robotics, automotive, and surveillance cameras. Titanium FPGAs are available in tiny packages that make it easy to add processing power to your edge system. The 3.5 x 3.4 mm 64-ball wafer-level CSP package is tiny enough to nestle right next to a sensor or camera, enabling low-latency vision and AI workloads at the source.

Complete Camera System