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Titanium FPGAs

Designed for Compute Acceleration


Low Power, Small Footprint,
Big Compute

You only have a few square millimeters to spare, and you need to pack in as much computing power as you can. Efinix’s next-generation Titanium FPGAs are fabricated on a 16 nm process and deliver high performance with the lowest possible power and a small physical size.

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Small Packages

With packages down to the tiny WLCSP at just 3.5 mm x 3.4 mm, Titanium FPGAs are designed for highly integrated applications.

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Hardened Controllers

Hardened MIPI D-PHY and LPDDR4/4x DRAM controllers support IoT, thermal cameras, industrial cameras, robotics, and smart devices.

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SEU Protection

Titanium devices can monitor device integrity. You can design your application to recover from random SEU events, ensuring maximum uptime.

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Bitstream Security

Bitstream authentication prevents unwanted tamperting, while bitstream encryption ensures that your design is secure.

Product Longevity

Titanium products are designed into a broad range of applications in many diverse markets. Some of these markets are characterized by long product life cycles and, once in high volume production, are resistant to changes in specifications or components in the bill of materials. At Efinix we get that and are committed to supplying our customers with a stable supply of supported products throughout their product life cycle. We are committed to supporting our Titanium family of FPGAs in customer designs until at least 2037. Contact your local sales representative for more information on product life cycles.

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Industrial Automation

Titanium FPGAs provide sensor fusion, data analysis, and real-time motor control to process the unprecedented quantities of data in today’s industrial applications.

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Edge and Internet of Things

With inherent area efficiency, take Titanium FPGAs to mass production ensuring a seamless transition from prototype to end product and a corresponding reduction in time to market.

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Titanium FPGAs are AEC-Q100 certified and ready to handle optical and LiDAR sensors to artificially intelligent data processing to display and motor control.

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Consumer and AR/VR

Hardened MIPI interfaces and comnpute capability means Titianium FPGAs can handle multiple video channels for real time positioning information as well as display and overlay information.

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Sensor Aggregation System

Sensor Aggregation System

More and more products are using cameras and sensors these days, collecting a wealth of data. How do you aggregate and process it all? The Ti90 and larger FPGAs have hardened 2.5G MIPI interfaces for a high-speed link. Additionally, the Titanium high-speed I/O (HSIO) pins support numerous single-ended and differential I/O standards. You can use them as regular GPIO or LVDS pairs. And, you can use them as MIPI RX or TX lanes running at speeds up to 1.5 Gbps.

These HSIO pins are fully user configurable, so you can mix and match them to fit your system needs. Use the HSIO pins with the MIPI-CSI-2 protocol to gather data from cameras or sensors and then send it to an application processor. Or, use the DSI protocol to send imaging to a display. The Efinity® software includes a suite of D-PHY, CSI-2, and DSI IP to help you create MIPI-based systems more easily.

Ti60 F100: Ready for Vision


Titanium FPGA Family

Feature Ti35 Ti60 Ti90 Ti120 Ti165 Ti180 Ti240 Ti375 Ti550 Ti750 Ti1000
Logic Elements (LEs) 36,176 62,016 92,534 123,379 162,800 176,256 236,888 370,137 550,000 750,000 1,000,004
10K RAM blocks (Mb) 1.53 2.62 6.88 9.18 12.1 13.11 17.62 27.53 40.92 55.8 74.4
DSP blocks 93 160 336 448 590 640 860 1,344 2,006 2,736 3,648
PLLs 4 4 10 10 12 10 12 12 12 12 12
GPIO 34 34 80 80 181 80 181 181 200 200 200
High-speed I/O 146 146 232 232 235 232 235 235 320 320 320
LPDDR4/4x x32 x32 2 x32 x32 2 x32 2 x32 2 x72 2 x72 2 x72
MIPI D-PHY 2.5 Gbps 4 RX
4 TX
4 RX
4 TX
3 RX
3 TX
4 RX
4 TX
3 RX
3 TX
3 RX
3 TX
3 RX
3 TX
3 RX
3 TX
3 RX
3 TX
Tranceivers x16 x16 x16 x24 x24 x24
25.8 Gbps Transceivers x8 x8 x8
Hardened RISC-V block Quad Core Quad Core Quad Core Quad Core Quad Core Quad Core
PCIe® Gen4 (16G) 2 x4 2 x4 2 x4 2 x8 2 x8 2 x8
Data sheet (PDF)
Product page

Refer to the FPGA data sheet or Titanium Selector Guide for details on which resources (e.g., number of I/O, number of PLLs, MIPI D-PHY, DDR support) are available in each package.

Titanium Package Options

Package Pitch (mm) Size (mm) Ti35 Ti60 Ti90 Ti120 Ti165 Ti180 Ti240 Ti375 Ti550 Ti750 Ti1000
64-ball WLCSP 0.4 3.5x3.4
100-ball FBGA 0.5 5.5x5.5
225-ball FBGA 0.65 10x10
256-ball FBGA 0.8 13x13
361-ball FBGA 0.65 13x13
400-ball FBGA 0.8 16x16
484-ball FBGA 0.8 18x18
529-ball FBGA 0.8 19x19
676-ball FBGA 0.8 22x22
900-ball FBGA 0.8 25x25
1,156-ball FBGA 1.0 35x35

Quantum® Compute Fabric

The innovative Quantum® compute fabric has an enhanced capability for compute functions. The 16 nm process node gives Titanium FPGAs a small footprint with low power consumption, making them ideal for highly integrated applications. With a wide range of logic element (LE) densities from 35K to 1M, and compatibility with the Efinix RISC-V SoCs, they can help you turn a tiny chip into an accelerated embedded compute system.

Why the XLR Cell is a Big Deal White Paper

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Titanium FPGA Block Diagram


Complete Camera System

Video is everywhere, particularly in mobile and mobile-influenced devices like machine vision, drones, robotics, automotive, and surveillance cameras. Titanium FPGAs are available in tiny packages that make it easy to add processing power to your edge system. The 3.5 x 3.4 mm 64-ball wafer-level CSP package is tiny enough to nestle right next to a sensor or camera.

Complete Camera System