Ti135 Available Package Options

Table 1. Available Packages
Package Dimensions (mm x mm) Pitch (mm)
441-ball FBGA 11 × 11 0.5
484-pin FBGA 18 × 18 0.8
576-pin FBGA1 16 × 16 0.65
676-ball FBGA 22 × 22 0.8
1 Available as a regular package and as a SIP that incorporates LPDDR4/4x DRAM in addition to the FPGA.