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April 14, 2026
Efinix attended embedded world 2026 in Nuremberg, Germany, held March 10–12, 2026. As one of the leading global exhibitions for embedded systems, the event brought together industry leaders, partners, and customers to explore the latest innovations. Below is a Q&A with the Efinix team sharing key takeaways from the show.
Key themes included increased customer awareness, continued expansion of our customer base, and stronger overall market recognition.
Efinix presented itself with a welcoming exhibition stand that invited technical discussions, while showcasing new trends and solutions.
Demo #1: 16Gbps SerDes Quality
Using a Teledyne LeCroy oscilloscope, Efinix showed PCIe Gen4 compliance and high-quality data performance.
Demo #2: SDI Transmission
Showed SDI transmission over a coaxial cable using a Titanium Ti375 FPGA on both the transmit and receive sides. Our FPGA converted a 4K HDMI 2.0 signal output from a Sony camera into a 12G SDI signal, which was then transmitted, and then—using another Titanium Ti375 FPGA—converted back to an HDMI 2.0 signal for display.
Demo #3: Super Resolution (AI Acceleration)
Using the Quad RISC-V integrated in into the Ti375 as an AI accelerator (4x CNN), we showcased upscaling the output from a thermal camera with a resolution of 180×144 pixels to generate a super-resolution image of 720×576 pixels.
Demo #4: Multi-Camera (Partner Demo with Imavix & Valens Semiconductor)
A demonstration showcasing multi-camera connectivity mediated via the MIPI A-PHY solution and GigE Vision protocol, with a Ti375 used to bridge these various interfaces and to real-time vision for IPC applications.
Demo #5: AI Computing Acceleration (People Detection)
A Titanium Ti375 PCIe Development Kit with Quad RISC-V and a 10GE IP core was used for AI hardware acceleration to detect people in real time.
Key trends included growing adoption of edge AI, increasing demand for flexible hardware acceleration, and a stronger focus on low-power design. FPGA platforms continue to be recognized as essential for applications requiring both adaptability and high performance.
Visitors consistently valued efficiency, cost-effectiveness, and design flexibility. Feedback highlighted appreciation for Efinix’s easy-to-use development tools, responsive support, and scalable FPGA solutions suitable for a wide range of applications.
Additionally, we expanded our mutual end-customer base through collaboration with partners such as Teledyne LeCroy, Imavix, and Valens Semiconductor.
The market clearly values low-power, small formfactor, cost-effectiveness, high-performance FPGA architectures and edge AI acceleration—exactly where our product roadmap is focused.
Customers and partners are using Efinix’s low-power, small form factor, and cost-effective FPGA solutions across a wide range of applications, including:
Industrial automation
Embedded vision
AI acceleration
Communications and networking
Consumer electronics
The event enabled productive discussions with current and prospective partners, customers, and members of the press, as well as a notable visit from the Bavarian State Ministry for Economic Affairs, Regional Development and Energy. Mr. Tobias Gotthardt met with our CEO Sammy Cheung, CVP of Business and Solutions Ching-Lun Yan, and VP of Marketing and Corporate Development Bob Beachler.
Efinix achieved a strong level of brand awareness among existing customers due to continued market expansion. With a rapidly growing customer base, this year saw a record level of engagement at embedded world 2026.
Several leading industrial companies have expressed their willingness to work with us to implement their technical solutions of tomorrow.
embedded world 2026 provided a valuable opportunity to connect with customers and partners and demonstrate real-world FPGA and edge AI solutions. The event reinforced Efinix’s growing presence in next-generation embedded designs.
Interested in learning more? Connect with the Efinix team.