Titanium and Topaz FPGAs Blazing Fast Data Transmission Solutions
System in Package Solutions (SiP)
Our SiP Solutions integrate FPGAs with essential system components into a single compact module — reducing PCB complexity, accelerating prototyping, and streamlining production for faster time-to-market. Ideal for applications from embedded vision to edge computing.
Efinix® FPGAs offer the performance, power efficiency, and compact design needed for next-generation consumer applications.
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Sapphire SoC Suite of RISC-V Processors
Efinix's Sapphire SoC suite of RISC-V processors provides a range of choices to meet your design requirements from a tiny soft core (Sapphire Lite SoC) to a highly configurable soft core (Sapphire SoC) to a 1-GHz capable hard core (High-performance Sapphire SoC).
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The Benefits of System-in-Package
In the rapidly evolving world of microelectronics, there is a relentless push to reduce size and power consumption while increasing compute capability and throughput. Smart edge devices, the internet of things and now Edge AI have only accelerated this trend. Read More >
FPGA Families
With up to 1 million logic elements, Titanium FPGAs bring high performance, high capacity, and low power to the mainstream market.
Combines an extra efficient architecture with commonly used features and protocols, so you can go big and still have room to innovate.
Trion FPGAs are for general-purpose logic applications and span 4K to 120K logic elements.
At the heart of our FPGAs is our disruptive Quantum® fabric, which delivers power, performance, and area advantages over traditional FPGA technologies. Our Titanium FPGAs are ready to unlock new applications and deliver rapid time to market for innovations in the mainstream marketplace. With densities ranging from 4K to 1 million logic elements (LEs), our FPGAs are ready to meet your next design challenge, whether it is custom logic, compute acceleration, machine learning, or deep learning.
