System in Package Solutions

Efinix System in Package (SiP) solutions combine an FPGA and one more or additional chips (e.g., memory) in a compact, ready to use form factor. These solutions reduce your board complexity, support faster prototyping, provide easier deployment to production, and shorten development cycles. With these advantages, SiP solutions are ideal for a wide range of applications from embedded vision to edge computing.

Our current SiP product offerings include:

  • Trion T13 and T20 FPGAs in the Q100F3 package with SPI flash
  • Titanium Ti35 and Ti60 FPGAs in the F100S3F2 package with SPI flash and HyperRAM device
  • Titanium Ti180 in the J484D1 package with LPDDR4x DRAM
  • Titanium Ti135 in the N576D2 package with LPDDR4/4x DRAM and SPI flash
  • Titanium Ti80 and Ti125 in the M225 package with SPI flash and two HyperRAM devices

LPDDR4x SDRAM

The Ti180J484D1 has 2 Gb of LPDDR4x DRAM built in, providing fast and efficient memory access for data intensive applications such as high-resolution cameras, vision systems, and industrial devices.


broadcast

Broadcast

HyperRAM Memory

Applications such as smart sensors and camera systems benefit from HyperRAM’s efficient data buffering. Use the memory for data storage and process it in the FPGA. With ultra-low power consumption, the HyperRAM device doesn’t use up your power budget.

machin vision

Machine Vision

Flash Memory

The on-board SPI flash eliminates the need for an external configuration flash device, which simplifies your board layout. You can also use it to store user data or a RISC-V Sapphire SoC application binary.



CCTV

Object Detection

Efinix SiP Packages

titanium logo
ti125sip

Ti80 and Ti125 M225S4F5

The integration of SPI flash and dual HyperRAM makes the Ti80 and Ti125 M225S4F5 FPGA a strong solution for embedded vision and sensor-based systems, including IoT devices, robotics, industrial automation, and smart devices.

  • Low power and cost optimization
  • Simplifies PCB design
  • Faster time-to-market
  • SPI flash memory for fast and secure boot
  • MIPI support up to 2.5 Gbps
  • SEU correction
  • 64-bit RISC-V processor

ti135sip

Ti135 N576D2

With integrated LPDDR4/4x memory, SPI flash, and high-speed transceivers, Titanium Ti135N576D2 FPGA delivers exceptional performance and connectivity for next-generation 5G, industrial automation, and automotive ADAS applications.

  • Low latency memory access
  • SPI flash memory for fast and secure boot
  • Energy efficient and space saving
  • PCIe® Gen4, 10 Gigabit Ethernet, SGMII, and PMA direct (up to 12.5G)

ti180sip

Ti180 J484D1

Titanium Ti180J484D1 FPGA with integrated LPDDR4x memory. This compact, power conscious device delivers 180K logic elements, high speed I/O, and 2 Gb of LPDDR4x DRAM, all in a single package measuring 15 mm on a side with a 0.65-mm ball pitch.

ti60f100

Ti35 and Ti60 F100S3F2

The combination of FPGA logic and data storage makes the Ti60 F100 a great solution for a variety of camera and sensor systems such as IoT, thermal cameras, industrial cameras, robotics, and smart devices.

  • Configurable high-speed I/O
  • HyperRAM memory for data storage
  • SPI flash memory for “Instant” on
  • More about: Ti60 F100: Ready for Vision

Buy now from Digikey:
Ti35F100S3F2, Ti60F100S3F2

trion logo
ti125sip

T13 and T20 QFP100F3

The T13 and T20 SIPs use Trion FPGAs in the Q100F3 package with an integrated SPI flash. These low-power devices are ideal for space constrained applications such as compact edge devices, control systems, and cost sensitive embedded solutions.

  • Low power consumption
  • SPI flash memory for configuration and user data

Buy now from Digikey:
T13Q100F3, T20Q100F3



Resources

Titanium

Titanium Ti180 Data Sheet

Titanium Ti135 Data Sheet

Titanium Ti60 Data Sheet

Titanium Ti35 Data Sheet

Trion

Trion T20 Data Sheet

Trion T13 Data Sheet