Efinix System in Package (SiP) solutions combine an FPGA and one more or additional chips (e.g., memory) in a compact, ready to use form factor. These solutions reduce your board complexity, support faster prototyping, provide easier deployment to production, and shorten development cycles. With these advantages, SiP solutions are ideal for a wide range of applications from embedded vision to edge computing.
Our current SiP product offerings include:
The Ti180J484D1 has 2 Gb of LPDDR4x DRAM built in, providing fast and efficient memory access for data intensive applications such as high-resolution cameras, vision systems, and industrial devices.
Broadcast
Applications such as smart sensors and camera systems benefit from HyperRAM’s efficient data buffering. Use the memory for data storage and process it in the FPGA. With ultra-low power consumption, the HyperRAM doesn’t use up your power budget.
Machine Vison
The on-board SPI flash eliminates the need for an external configuration flash device, which simplifies your board layout. You can also use it to store user data or a RISC-V Sapphire SoC application binary.
Object detection
Titanium Ti180J484D1 FPGA with integrated LPDDR4x memory. This compact, power conscious device delivers 180K logic elements, high speed I/O, and 2 Gb of LPDDR4x DRAM, all in a single package measuring 15 mm on a side with a 0.65-mm ball pitch.
The combination of FPGA logic and data storage makes the Ti60 F100 a great solution for a variety of camera and sensor systems such as IoT, thermal cameras, industrial cameras, robotics, and smart devices.
Buy now from Digikey:
Ti35F100S3F2, Ti60F100S3F2
The T13 and T20 SIPs use Trion FPGAs in the Q100F3 package with an integrated SPI flash. These low-power devices are ideal for space constrained applications such as compact edge devices, control systems, and cost sensitive embedded solutions.