T13 Revision History
| Date | Version | Description |
|---|---|---|
| November 2025 | 4.9 | Added details about the maximum clock rate for the SPI flash device
in QFP100F3 packages. Updated T13 Unused Resources and Features.
(DOC-2610) Updated T13 SPI Flash Memory. Updated CBSEL[1:0] in Table 3. |
| April 2025 | 4.8 | Fixed typo in Table 1. (DOC-2500) |
| April 2025 | 4.7 | Correction to T13 MIPI Power-Up Timing. Updated LVDS used as GPIO state in Pin States
topic.Updated configuration timing waveforms.
(DOC-2325) Corrected MIPI reset timing diagram.
(DOC-2323) Moved information about unused resources to
T13 Unused Resources and Features. |
| November 2024 | 4.6 | Updated GPIO interface pin names (IN to I and OUT to O).
(DOC-2086) Fixed typo in Table 3. (DOC-2038) Footnote added to Table 1. (DOC-1939) Removed Dynamic Enable Pin Name from
Table 3. Pin does not exist in Trion family.
(PT-2355) Added Pin States topic.
(DOC-2087) SPI and JTAG pins should not be active at
the same time for configuration. (DOC-2046) Renamed
package prefix to match Efinity software (e.g.,
BGA changesd to F). |
| February 2024 | 4.5 | Updated SPI passive timing waveform. Added note about external
DC-biased circuit is required if the incoming LVDS signals are
AC-coupled and link to Trion Hardware Design
Checklist and Guidelines. (DOC-1532) |
| October 2023 | 4.4 | Added note about maximum CLOAD for SPI pins for DIV4 SPI active mode in QFP100F3 packages. (DOC-1423) |
| October 2023 | 4.3 |
Added LVDS RX Static Mode Delay Setting. (DOC-1473)
Updated Maximum Toggle Rate table by adding recommendation to run
simulation for actual taggle rate. (DOC-1468)
Updated 2.5 V and 1.8 LVCMOS Single-Ended I/O Internal Weak
Pull-Up and Pull-Down Resistance. (DOC-1476)
Updated absolute maximum ratings for VCCIO1A_1B_1C and
TJ, removed preliminary notes, and updated SPI flash
block topic for in QFP100F3 packages. (DOC-1503)
|
| September 2023 | 4.2 |
Updated maximum LVDS toggle rate for QFP100F3 packages.
(DOC-1447)
Updated CCK pin description. (DOC-1447)
|
| June 2023 | 4.1 | Updated SPI Flash Memory Signals table. |
| June 2023 | 4.0 |
Removed tLVDS_DT and tINDT specs, and
replaced with tPLL_HLW and tLVDS_CPA.
(DOC-1189)
Updated PLL LOCKED signal description. (DOC-1208)
|
| April 2023 | 3.9 | Added support for Q100F3 packages. Corrected tLVDS_SU
and tLVDS_HD specs (DOC-1070) Updated PLL RSTN
signal description about de-asserting only when CLKIN is stable.
(DOC-1226) |
| February 2023 | 3.8 |
Updated tLVDS_skew specs. (DOC-1111)
Updated tLVDS_SU specs (DOC-1070)
Updated power up sequence diagram. (DOC-954)
Added note to use LVDS blocks from the same side to minimize skew.
(DOC-1150)
Updated Advanced PLL Settings table descriptions. (DOC-945)
|
| November 2022 | 3.7 |
Added note recommending up to only 2 cascading PLLs.
(DOC-931)
Corrected IOH and IOL in buffer drive
strength characteristic specifications. (DOC-933)
Updated FVCO, FPLL, and FPFD PLL
Timing parameter specifications and PLL Interface Designer Settings
- Manual Configuration Tab notes. (DOC-1019)
Added tLVDS_SU, tLVDS_HD specs and LVDS RX timing waveforms.
|
| September 2022 | 3.6 |
Removed PLL_EXTFB from alternative input. (DOC-849)
Updated Advanced PLL LOCKED signal description. (DOC-763)
|
| April 2022 | 3.5 |
Updated test condition load to maximum load in Maximum Toggle Rate
Table. (DOC-781)
Updated Connection Requirements for Unused Resources table by
specifying VCC value. (DOC-770)
Updated note about leaving at least 2 pairs of unassigned LVDS pins
between any GPIO and LVDS in the same device side. (DOC-769)
|
| March 2022 | 3.4 |
Updated behaviour description for GPIO and LVDS as GPIO pins during
configuration, and unused GPIO pins during user mode.
(DOC-720)
Added note about the block RAM content is random and undefined if
it is not initialized. (DOC-729)
Updated power supply ramp rate and power up sequence diagram.
(DOC-631)
|
| January 2022 | 3.3 | Added LVDS Pins Configured as Single-Ended I/O Buffer Drive Strength Characteristics. |
| January 2022 | 3.2 | Corrected power supply ramp rate. (DOC-699) |
| January 2022 | 3.1 | Removed LVDS Pins Configured as Single-Ended I/O Buffer Drive
Strength Characteristics. (DOC-679) Added Output Differential
Voltage with Reduce VOD Swing option enabled specs.
(DOC-648) Added maximum I/O pin input current,
IIN, and maximum per bank specs.
(DOC-652) Added PLL input clock duty cycle,
tINDT, specs. (DOC-661) Updated CDONE pin
direction as bidirectional. (DOC-672) |
| November 2021 | 3.0 |
Added storage temperature, TSTG spec. (DOC-560)
Updated maximum JTAG mode TCK frequency, fTCK.
(DOC-574)
Updated CSI pin description. (DOC-546)
Updated LVDS Pins Configured as Single-Ended I/O Buffer Drive
Strength specifications. (DOC-578)
Update LVDS standard compliance which is TIA/EIA-644.
(DOC-592)
Updated tCLKH and tCLKL, and corrected SPI
Passive Mode (x1) Timing Sequence waveform. (DOC-590)
Updated REF_RES_xx description. (DOC-602, DOC-605)
Updated Maximum Toggle Rate table. (DOC-630)
Updated minimum Power Supply Ramp Rates and Power Up Sequence
figure. (DOC-631)
|
| September 2021 | 2.14 | Added Single-Ended I/O and LVDS Pins Configured as Single-Ended I/O
Rise and Fall Time specs. (DOC-522) Added note to Active mode
configuration clock frequency stating that for parallel daisy chain
x2 and x4 configuration, fMAX_M, must be set to DIV4.
(DOC-528) Added Global Clock Location topic.
(DOC-532) Added Maximum tUSER for SPI Active
and Passive Modes topic. (DOC-535) |
| August 2021 | 2.13 | Added internal weak pull-up and pull-down resistor specs.
(DOC-485) Updated table title for Single-Ended I/O Schmitt
Trigger Buffer Characteristic. (DOC-507) Added note in
Pinout Description stating all dedicated configuration pins have
Schmitt Trigger buffer. (DOC-507) |
| June 2021 | 2.12 |
Updated CRESET_N pin description. (DOC-450)
|
| April 2021 | 2.11 | Updated PLL specs; tILJIT (PK - PK) and tDT.
(DOC-403) Added note about limiting number of LVDS as GPIO
output and bidirectional per I/O bank to avoid switching noise.
(DOC-411) |
| March 2021 | 2.10 | Added LVDS TX reference clock output duty cycle and lane-to-lane skew specs. (DOC-416) |
| March 2021 | 2.9 | Added automotive speed grade (Q4) specs for F169 package. (DOC-399) |
| February 2021 | 2.8 | Added I/O input voltage, VIN specification.
(DOC-389) Added LVDS TX data and timing relationship waveform.
(DOC-359) Added LVDS RX I/O electrical specification
waveform. (DOC-346) |
| December 2020 | 2.7 | Updated NSTATUS pin description. (DOC-335) Added data for C4L and
I4L DC speed grades. (DOC-268) Updated PLL reference clock
input note by asking reader to refer to PLL Timing and AC
Characteristics. (DOC-336) Added other PLL input clock
frequency sources in PLL Timing and AC Characteristics.
(DOC-336) Removed OE and RST from LVDS block as they are
not supported in software. (DOC-328) Added a table to
Power Up Sequence topic describing pin connection when PLL, GPIO, or
MIPI is not used. (DOC-325) Updated fMAX_S for
passive configuration modes. (DOC-350) Updated
fMAX_S for passive configuration modes.
(DOC-350) |
| September 2020 | 2.6 | Updated pinout links. Corrected speed grades for single-ended I/O
and LVDS configured as single-ended I/O
fMAX. |
| August 2020 | 2.5 | Update MIPI TX and RX Interface Block Diagram to include signal
names. Updated REF_CLK description for clarity. Added
recommended operating conditions and fMAX for C4L and I4L
speed grades. Updated tUSER timing parameter
values and added a note about the conditions for the
values. Updated description for GPIO pins state during
configuration to exclude LVDS as GPIO. Added
fMAX for single-ended I/O and LVDS configured as
single-ended I/O. Added maximum power supply current
transient during power-up. |
| July 2020 | 2.4 |
Removed preliminary note from MIPI electrical specifications and
timing. These specifications are final.
Updated timing parameter symbols in boundary scan timing waveform
to reflect JTAG mode parameter symbols.
Added supported GPIO features.
Updated the maximum FVCO for PLL to 1,600 MHz.
Updated the C divider requirement for the 90 degrees phase shift in
the PLL Interface Designer Settings - Manual Configuration
Tab.
Updated LVDS electrical specifications note about RX differential
I/O standard support, and duplicated the note in LVDS functional
description topic.
Added note to LVDS RX interface block diagram.
Added note to recommended power-up sequence about MIPI power
guideline.
Updated I/O bank names from TL_CORNER, BL_CORNER, TR_CORNER, and
BR_CORNER to TL, BL, TR, and BR respectively.
Updated the term DSP to multiplier.
Updated power up sequence description about holding CRESET_N
low.
Updated PLLCLK pin name to PLL_CLKIN.
Added PLL_EXTFB and MIPI_CLKIN as an alternative input in GPIO
signals table for complex I/O buffer.
Updated PLL names in PLL reference clock resource
assignments.
Updated supported configuration modes.
Updated typical leakage current to 6.8 mA and add a note stating it
is applicable to F256 package.
|
| February 2020 | 2.3 | Added fMAX for DSP blocks and RAM blocks. In
MIPI RX and TX interface description, updated maximum data pixels for
RAW10 data type.Added MIPI reset timing
information. Added Trion power-up sequence. MIPI power-up
moved to this topic. VCC12A_MIPI_TX, VCC12A_MIPI_RX
maximum recommended operating condition changed to 1.25
V. Added number of global clocks and controls that can
come from GPIO pins to package resources table. |
| December 2019 | 2.2 | Updated PLL Interface Designer settings. Removed MIPI data type
bit settings. Refer to AN 015: Designing with the Trion MIPI
Interface for the bit settings. Removed DIV1 and DIV2
active mode configuration frequencies; they are not
supported. Added note to LVDS electrical specifications
about RX differential I/O standard support. |
| October 2019 | 2.1 | Added explanation that 2 unassigned pairs of LVDS pins should be
located between and GPIO and LVDS pins in the same bank. Updated the
reference clock pin assignments for TL_PLL0 and
TL_PLL1. Added waveforms for configuration
timing. |
| August 2019 | 2.0 | Updated MIPI interface description. Under Ordering Codes, linked
to Trion FPGA Selector Guide. |
| May 2019 | 1.0 | Updated MIPI description, DC characteristics, and pin
information. Updated timing specifications. Added
information on the signal interface. |
| January 2019 | 0.5 | Added information on DDIO support. |
| December 2018 | 0.4 | Updated the package options. |
| November 2018 | 0.3 | Added GNDA_xx (PLL analog ground) to pinout. Change
VSSxxA_MIPI pinout to GNDxxA_MIPI. Updated PLL
block diagram and clarified feedback paths. Added
floorplan information. Updated pinout table. Updated
packaging options. |
| October 2018 | 0.2 |
Updated LVDS serialization factors.
|
| October 2018 | 0.1 | Initial release. |