T13 Features

  • High-density, low-power Quantum® architecture
  • Built on SMIC 40 nm process
  • Core leakage current as low as 6.8 mA1
  • FPGA interface blocks
    • GPIO
    • PLL
    • LVDS 800 Mbps per lane with up to 13 TX pairs and 13 RX pairs
    • MIPI DPHY with CSI-2 controller hard IP, 1.5 Gbps per lane
  • Programmable high-performance I/O
    • Supports 1.8, 2.5, and 3.3 V single-ended I/O standards and interfaces
  • Flexible on-chip clocking
    • 16 low-skew global clock signals can be driven from off-chip external clock signals or PLL synthesized clock signals
    • PLL support
  • Flexible device configuration
    • Standard SPI interface (active, passive, and daisy chain)
    • JTAG interface
    • Optional Mask Programmable Memory (MPM) capability
  • Fully supported by the Efinity® software, an RTL-to-bitstream compiler
Table 1. T13 FPGA Resources
LEs2 Global Clock Networks Global Control Networks Embedded Memory (kbits) Embedded Memory Blocks (5 Kbits) Embedded Multipliers
12,828 Up to 16 Up to 16 727.04 142 24
Table 2. T13 Package-Dependent Resources
Resource Q100F3 F169 F256
Available GPIO3 65 73 195
Global clocks from GPIO pins 4 4 16
Global controls from GPIO pins 5 3 16
PLLs 5 5 5
LVDS 4 TX pairs
4 RX pairs
 8 TX pairs
12 RX pairs
 13 TX pairs
13 RX pairs
MIPI DPHY with CSI-2 controller
(4 data lanes, 1 clock lane)
 – 2 TX instances
2 RX instances
–
Notice: Refer to the Trion Packaging User Guide for the package outlines and markings.
1 Typical leakage current for F256 package only.
2 Logic capacity in equivalent LE counts.
3 The LVDS I/O pins are dual-purpose. The full number of GPIO are available when all LVDS I/O pins are in GPIO mode. GPIO and LVDS as GPIO supports different features. See Table 2.