T55 Introduction
T55 Features
- T55 Available Package Options
T55 Device Core Functional Description
T55 Device Interface Functional Description
T55 Power Up Sequence
- T55 Power Supply Current Transient
- T55 Unused Resources and Features
T55 Configuration
- T55 Supported Configuration Modes
T55 DC and Switching Characteristics
T55 LVDS I/O Electrical and Timing Specifications
T55 ESD Performance
T55 MIPI Electrical Specifications and Timing
- T55 MIPI Power-Up Timing
- T55 MIPI Reset Timing
T55 PLL Timing and AC Characteristics
T55 Configuration Timing
T55 Pinout Description
- T55 Pin States
T55 Efinity Software Support
T55 Interface Floorplan
T55 Ordering Codes
T55 Revision History

T55 Available Package Options

Table 1. Available Packages
Package	Dimensions (mm x mm)	Pitch (mm)
324-ball FBGA	12 x 12	0.65
484-ball FBGA	18 x 18	0.80
576-ball FBGA	16 x 16	0.65

Parent topic: T55 Features

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